E2 Series

The E2 Series is highly optimized for area and power while still offering class-leading performance. Targeted for microcontroller and embedded devices, the E2 Core can be configured to be as small as 13.5k gates with an efficient 2 stage pipeline or configured for higher performance with a 3 stage pipeline, hardware floating-point, instruction cache, and more.

With SiFive Core Designer, the E2 Series can be fully customized to meet your specific requirements.

E2 Series Key Features

Configurable core performance

Single precision Floating Point Unit

Custom memory map and ports

Optional Tightly Integrated Memory (TIM)

RV32E support with the smallest core configuration as small as 13.5k gates and is .005mm2 in 28nm

SiFive Insight Advanced Trace and Debug


MEMS Sensors

Power managment

Digital motor control

Low-power MCUs

Health wearable monitors

Environmental monitors

E3 Series

The E3 Series is highly-integrated and feature-rich. It includes the E31 Core, which is the most widely deployed RISC V core in the world. E3 embedded cores have a 5-6 stage pipeline, offering a great balance between performance and efficiency.

E3 Series Key Features

Up to 8 coherent E3 Cores and optional L2 Cache Controller

Optional Single or Double precision Floating Point Unit

Level 1 Memory System and ECC

Number, type, and width of bus interfaces

Support for SiFive Insight Advanced Trace and Debug


Consumer Electronics

Motor Control

Industrial Automation


High-performance embedded

E7 Series

The E7 Series offers a 32-bit embedded processor targeting applications that require high performance while maintaining energy efficiency. The E7 core has a superscalar 8-stage in-order pipeline.

E7 Series Features

7 core architectural features

  • RV32GCV capable core
  • Dual Issue, in-order 8 stage Harvard Pipeline

Performance and Area

  • DMIPS – 2.5 DMIPS/MHz
  • Coremark – 5.1 CoreMarks/MHz
  • Core Area is only 30% larger than equivalent 3/5 Series Core

Very flexible memory system

  • Optional I$ and D$
  • Optional I and D TCM interfaces
  • Optional Fast IO (FIO) for low latency, high-bandwidth, memory mapped IO

Functional Safety and Security and Real Time features

  • SECDED ECC on all L1 and L2 memories
  • Programmatically clear and/or disable dynamic branch prediction for deterministic execution and enhanced security

Multi-Core Capable with Coherency and optional L2

High End Embedded Applications

SSD Controllers

IoT Edge Computing

Wireless Radios